Research output per year
Research output per year
Research output
Search results
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2025
Parametric Modeling Analysis and Lifetime Prediction of Large-Size Conductive Adhesive Bonding Layers
Li, W., Luo, A., Yang, L., Wu, Y., Liu, X., Wang, X., Su, Y. & Hu, T., 2025, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024 — International Conference on Computational and Experimental Engineering and Sciences ICCES. Zhou, K. (ed.). Springer Science and Business Media B.V., p. 665-678 14 p. (Mechanisms and Machine Science; vol. 175 MMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2024
Dynamic response of interconnects in board-level packaging structure at extremely high strain rates
Long, X., Hu, Y., Shi, H. & Su, Y., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 887-891 5 p. (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of Space Environment on the Reliability of Conductive Adhesive Joints
Ren, L., Wu, Y., Zhang, L., Gao, Y. & Long, X., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2023—Volume 3. Li, S. (ed.). Springer Science and Business Media B.V., p. 975-983 9 p. (Mechanisms and Machine Science; vol. 146).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Exploring the Patent Landscape of Sintered Metal Technologies: An Analysis Using LLM-Based AI Patent Search
Siow, K. S., Wang, W., Bahru, R., Long, X. & Lee, H. W., 2024, 2024 IEEE 40th International Electronics Manufacturing Technology, IEMT 2024. Institute of Electrical and Electronics Engineers Inc., (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Finite Element Modelling and Life Prediction of Solder Joints of Board Level Devices Under Power Cyclic Load
Luo, A., Wan, B., Su, Y. & Zhang, S., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024—Volume 1. Zhou, K. (ed.). Springer Science and Business Media B.V., p. 153-164 12 p. (Mechanisms and Machine Science; vol. 168 MMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Microcrack Detection and Localization in Laminated Packaging Structures Using Superlets and Lamb Wave Static Components
Long, X., Li, Y., Wang, J., Zhao, L., Yuan, W. & Gu, T., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1042-1046 5 p. (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Optimal Design of Vibration and Thermal Reliability of Printed Circuit Board Mounting Components for Space Electronic Equipment
Fu, Y., Wang, S., Wang, Q., Liu, J., Long, X. & Li, K., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024—Volume 1. Zhou, K. (ed.). Springer Science and Business Media B.V., p. 761-777 17 p. (Mechanisms and Machine Science; vol. 168 MMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Physical information neural network-based mechanical response prediction for sintered nano-silver materials
Long, X., Ding, X., Shi, H., Su, Y. & Gu, T., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1052-1055 4 p. (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Review of Non-contact Blade Vibration Monitoring Based on Blade Tip Timing
Wang, F., Fu, C., Zheng, L., Lu, K. & Gu, F., 2024, Proceedings of the UNIfied Conference of DAMAS, IncoME and TEPEN Conferences (UNIfied 2023) - Volume 1. Ball, A. D., Wang, Z., Ouyang, H. & Sinha, J. K. (eds.). Springer Science and Business Media B.V., p. 459-469 11 p. (Mechanisms and Machine Science; vol. 151 MMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Robust Event-Triggered Model Predictive Control for Uncertain Linear Parameter-Varying Systems
Jiang, H., Guo, Y., Liu, T., Fan, Q. Y. & Lu, K., 2024, 2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024. Institute of Electrical and Electronics Engineers Inc., p. 625-630 6 p. (2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Strain Rate Effect on Indentation Behavior of Polycrystalline Sintered Silver Nanoparticles Based on Crystal Plasticity Finite Element Method
Long, X., Dong, R., Shi, H., Huang, T., Shao, Z. & Su, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Study on Dynamic Modeling and Vibration Noise Suppression Method of AUV
Zhang, K., Fu, C., Lu, K., Zhang, K., Cheng, H. & Guo, D., 2024, Advances in Applied Nonlinear Dynamics, Vibration, and Control – 2023 - The Proceedings of 2023 International Conference on Applied Nonlinear Dynamics, Vibration, and Control ICANDVC2023. Jing, X., Ding, H., Ji, J. & Yurchenko, D. (eds.). Springer Science and Business Media Deutschland GmbH, p. 151-164 14 p. (Lecture Notes in Electrical Engineering; vol. 1152).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Thermal Conductivity Simulation of Sintered Nano-Silver for High-Power Electronic Devices
Long, X., Zhao, X., Shi, H., Chang, C., Wang, Z. & Su, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2023
Dimensionless contact stiffness model to unveil the strain rate effect of nickel-based single crystal superalloy by nanoindentation
Shen, Z., Su, Y., Liang, Z. & Long, X., 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 747-750 4 p. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Dynamic Analysis of Four Point Contact Ball Bearings
Li, Z., Zhang, H. & Xie, Z., 2023, 2023 Global Reliability and Prognostics and Health Management Conference, PHM-Hangzhou 2023. Guo, W. & Li, S. (eds.). Institute of Electrical and Electronics Engineers Inc., (2023 Global Reliability and Prognostics and Health Management Conference, PHM-Hangzhou 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of cohesive behaviour and residual stress on the indentation response of elastoplastic film/substrate structure
Li, J. & Long, X., 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 829-833 5 p. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of current on the growth of intermetallic compounds in Sn-3.0Ag-0.5Cu solder joints
Li, B., Wang, J. & Yao, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Meso-scale crystal plasticity modeling of sintered silver nanoparticles in typical interconnected structures
Long, X., Chong, K., Chang, C. & Su, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Multidisciplinary Design Optimization Investigation of Air-Cooled Turbine Blade for Marine Gas Turbine
Niu, X., Lin, F., Li, X., Gao, M., Zhang, X., Li, L. & Gao, J., 2023, 2023 International Conference on Marine Equipment and Technology and Sustainable Development. Yang, D. (ed.). Springer Science and Business Media Deutschland GmbH, p. 18-31 14 p. (Lecture Notes in Civil Engineering; vol. 375 LNCE).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Reliability Evaluation of Sintered AgNPs Strength Degradation: Influence of Microstructural Evolution during Thermal Aging
Wu, Z., Su, Y., Duan, C., Cheng, X. & Long, X., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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The Array Optimization Model for Distributed Antisubmarine of Non-cluster USV Based on Coverage
Niu, Y., Zhang, K., Mu, Y., Wang, Q. & Wang, Y., 2023, Proceedings of 2022 International Conference on Autonomous Unmanned Systems, ICAUS 2022. Fu, W., Gu, M. & Niu, Y. (eds.). Springer Science and Business Media Deutschland GmbH, p. 2402-2412 11 p. (Lecture Notes in Electrical Engineering; vol. 1010 LNEE).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2022
An Improved Interpolation Algorithm for the Damped Signal Based on Hann Window
Xu, H., Zhou, S., Qin, W. & Litak, G., 2022, Proceedings - 2022 14th International Conference on Signal Processing Systems, ICSPS 2022. Institute of Electrical and Electronics Engineers Inc., p. 269-277 9 p. (Proceedings - 2022 14th International Conference on Signal Processing Systems, ICSPS 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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EFFECT OF DEFLECTION ANGLE ON FLOW AND HEAT TRANSFER IN A ROTATING U-CHANNEL
Li, H., Li, L., Tang, Z., Zhang, Z. & Yuan, T., 2022, Heat Transfer - General Interest/Additive Manufacturing Impacts on Heat Transfer; Internal Air Systems; Internal Cooling. American Society of Mechanical Engineers (ASME), V06BT15A027. (Proceedings of the ASME Turbo Expo; vol. 6-B).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of surface energy on the bond strength of conductive adhesive
Zhu, Z., Xu, J., Yu, Z., Wang, J., Wu, H. & Long, X., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Equivalence of nanoindentations by the load and displacement controlled manners
Shen, Z., Dong, R., Chong, K., Liu, Y., Su, Y. & Long, X., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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PHASE-FIELD MODELLING FOR CRACK EVOLUTION OF PBX UNDER THERMOMECHANICAL LOADINGS
Long, X., Zhu, J., Su, Y., Siow, K. S. & Chen, C., 2022, Acoustics, Vibration, and Phononics. American Society of Mechanical Engineers (ASME), V001T01A009. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 1).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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PRACTICAL INSIGHT INTO INERTIAL ACTUATORS ARRANGEMENT OPTIMIZATION FOR ACTIVE CONTROL SYSTEMS
Wrona, S., Pawelczyk, M. & Xie, Z., 2022, Proceedings of the 28th International Congress on Sound and Vibration, ICSV 2022. Society of Acoustics, (Proceedings of the International Congress on Sound and Vibration).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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QUANTIFICATION AND PROPAGATION OF UNCERTAINTY IN CRITICAL SPEEDS AND MODE SHAPES OF ROTATING STRUCTURES
Luo, W., Fu, C., Lu, K. & Yang, Y., 2022, IET Conference Proceedings. 13 ed. Institution of Engineering and Technology, Vol. 2022. p. 700-704 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Rapid model generation and analysis of mechanical behaviour of electronic packaging structures by machine learning
Long, X., Ding, X., Su, Y., Liu, Y., Shi, H., Chen, W. & Tang, R., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Research on Airworthiness Qualification Test Technology of Radiation Emission in Civil Aircraft Flight Control Electronic System
Kuan, L., Aijun, L., Tianbo, W., Linxiao, L. & Jianyuan, W., 2022, Proceedings of the 5th China Aeronautical Science and Technology Conference. Springer Science and Business Media Deutschland GmbH, p. 951-962 12 p. (Lecture Notes in Electrical Engineering; vol. 821 LNEE).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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SEMI-ACTIVE CONTROL OF NONSTATIONARY NOISE TRANSMITTED THROUGH STRUCTURES
Wrona, S., Pawelczyk, M. & Xie, Z., 2022, Proceedings of the 28th International Congress on Sound and Vibration, ICSV 2022. Society of Acoustics, (Proceedings of the International Congress on Sound and Vibration).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Thermal effects on fracture behaviors of the die-attachment in the SiC power device under power cyclic conditions based on fracture phase-field modeling
Su, Y., Tu, B., Tang, R. & Long, X., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2021
Determining mechanical properties of thin film in packaging structures by in-situ nanoindentation
Jia, Q., Shen, Z., Su, Y., Tang, R. & Long, X., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 616-619 4 p. (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of cast and heat treatment processes on microstructure and properties of k4169 superalloy
Lian, Y. D., Gao, L. Q., Wang, P., Yin, Q., Hu, P. P. & Wen, Z. X., 2021, Metallurgy Technology and Materials VIII - Selected peer-reviewed full text papers from the 8th International Conference on Metallurgy Technology and Materials, ICMTM 2020. Mohamed, N. S. (ed.). Trans Tech Publications Ltd, p. 25-30 6 p. (Solid State Phenomena; vol. 315 SSP).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of Surface Stress on Indentation Response of Elastic-Plastic Materials
Long, X., Shen, Z., Chang, X., Su, Y., Shi, H., Huang, T., Wu, Y. & Tu, B., 14 Sep 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of Temperature on the Fatigue Damage of SAC305 Solder
Long, X., Guo, Y., Chang, X., Su, Y., Shi, H., Huang, T., Tu, B. & Wu, Y., 14 Sep 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Fatigue behaviour of small-sized in-situ packaging materials based on a single-point nanoindentation with cyclic penetrations
Long, X., Li, J., Jia, Q., Shen, Z., Su, Y. & Tang, R., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 609-615 7 p. (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Fatigue life of Ni-based single crystal super-alloy specimen with single hole
Xue, X., Wen, Z. & Li, W., 2021, Materials Science and Technologies. Li, Z. J. (ed.). Trans Tech Publications Ltd, p. 10-16 7 p. (Key Engineering Materials; vol. 891 KEM).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Growth kinetics of intermetallic compound in solder joints during thermal cycling: A review
Xu, J., Guo, Y., Su, Y., Tang, R. & Long, X., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 464-468 5 p. (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Influences of the γ′ phase on the mechanical properties of a nickel-based single crystal superalloy
Wang, X. Y., Li, M. & Wen, Z. X., 2021, Material Science and Engineering Technology IX - Selected peer-reviewed full text papers from the 9th ICMSET 2020, 9th ICNNN 2020, and 5th ICMTA 2020. Agarwal, R. K. (ed.). Trans Tech Publications Ltd, p. 45-52 8 p. (Materials Science Forum; vol. 1023 MSF).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Investigation on stress and strain of ni-based single crystal super-alloy specimen with single hole based on abacus
Xue, X., Wen, Z. & Li, W., 2021, Materials Science and Technologies. Li, Z. J. (ed.). Trans Tech Publications Ltd, p. 17-22 6 p. (Key Engineering Materials; vol. 891 KEM).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates
Long, X., Su, T., Chang, C., Huang, J., Chang, X., Su, Y., Shi, H., Huang, T. & Wu, Y., 14 Sep 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Numerical analysis on the leading edge film cooling of bifurcation holes for gas turbine blade
Tang, Z., Xie, G., Li, H., Gao, W., Tan, C. & Li, L., 2021, Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021. American Society of Mechanical Engineers (ASME), V001T04A003. (Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Numerical Simulation Analysis of Flexible Printed Circuits under Bending Conditions
Liu, Y., Wang, H., Hu, X., Peng, C., Long, X., Lu, J., Sun, R. & Wong, C. P., 14 Sep 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Optimal design of novel laminated cooling system considering cooling effectiveness and thermomechanical performance
Li, H., Li, L., Gao, W., Tang, Z., Tan, C. & Ren, S., 2021, Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021. American Society of Mechanical Engineers (ASME), V001T04A002. (Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling
Zhu, J., Su, Y., Chuantong, C., Siow, K. S., Tang, R. & Long, X., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 317-321 5 p. (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Sequential Analysis of Drop Impact and Thermal Cycling of Electronic Packaging Structures
Liu, Y., Long, X., Wang, H., Lu, J., Sun, R. & Wong, C. P., 14 Sep 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2020
Application of the Second Dimension Reduction Method in Nonlinear Rotor Dynamic System
Lu, K., Zhang, H., Zhou, H., Jin, Y., Yang, Y. & Fu, C., 2020, Nonlinear Dynamics of Structures, Systems and Devices - Proceedings of the 1st International Nonlinear Dynamics Conference, NODYCON 2019. Lacarbonara, W., Balachandran, B., Ma, J., Tenreiro Machado, J. A. & Stepan, G. (eds.). Springer Nature, p. 533-548 16 p. (Nonlinear Dynamics of Structures, Systems and Devices - Proceedings of the 1st International Nonlinear Dynamics Conference, NODYCON 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Constitutive model and parameter identification for lead-free SAC305 solder
Long, X., Chen, Z. & Shi, H., Aug 2020, 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020. Institute of Electrical and Electronics Engineers Inc., 9202676. (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Micromorphology analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate
Xu, J., Chen, C. & Long, X., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 312-315 4 p. 9315063. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review