TY - GEN
T1 - Micromorphology analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate
AU - Xu, Junmeng
AU - Chen, Chuantong
AU - Long, Xu
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/12/2
Y1 - 2020/12/2
N2 - The microstructure and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) under different working conditions were studied by static compression tests. The constitutive behaviour of SAC305 material with wide ranges of temperature and strain rate was obtained and correlated with the micromorphology on the specimen surface in this paper. With the temperature varies, the micromorphology of the solder specimens changed significantly. Specifically, as the temperature increases, more compression fringes along the loading direction appeared on the surface of the specimen, and the length of the fringes was elongated. Moreover, the mechanical properties of the solder showed obvious softening phenomenon, that is, the compressive strength decreased gradually. With the increase of the loading strain rate, the micromorphology showed the opposite evolution law compared with the consequences when the temperature increases. That is, the compression fringes gradually decrease and shorten, and the strength increased continuously, which shows an obvious hardening phenomenon. Under the condition of high temperature and low strain rate, a macro crack with the degree of 45° with respect to the compression axis can also be found on the surface of static compression specimen, and its length and width changed regularly with temperature and strain rate.
AB - The microstructure and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) under different working conditions were studied by static compression tests. The constitutive behaviour of SAC305 material with wide ranges of temperature and strain rate was obtained and correlated with the micromorphology on the specimen surface in this paper. With the temperature varies, the micromorphology of the solder specimens changed significantly. Specifically, as the temperature increases, more compression fringes along the loading direction appeared on the surface of the specimen, and the length of the fringes was elongated. Moreover, the mechanical properties of the solder showed obvious softening phenomenon, that is, the compressive strength decreased gradually. With the increase of the loading strain rate, the micromorphology showed the opposite evolution law compared with the consequences when the temperature increases. That is, the compression fringes gradually decrease and shorten, and the strength increased continuously, which shows an obvious hardening phenomenon. Under the condition of high temperature and low strain rate, a macro crack with the degree of 45° with respect to the compression axis can also be found on the surface of static compression specimen, and its length and width changed regularly with temperature and strain rate.
KW - Compression
KW - Mechanical property
KW - Micromorphology
KW - Solder
UR - http://www.scopus.com/inward/record.url?scp=85100185799&partnerID=8YFLogxK
U2 - 10.1109/EPTC50525.2020.9315063
DO - 10.1109/EPTC50525.2020.9315063
M3 - 会议稿件
AN - SCOPUS:85100185799
T3 - 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
SP - 312
EP - 315
BT - 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
Y2 - 2 December 2020 through 4 December 2020
ER -