TY - GEN
T1 - Effect of Surface Stress on Indentation Response of Elastic-Plastic Materials
AU - Long, Xu
AU - Shen, Ziyi
AU - Chang, Xiaotong
AU - Su, Yutai
AU - Shi, Hongbin
AU - Huang, Tao
AU - Wu, Yanpei
AU - Tu, Bingyi
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/9/14
Y1 - 2021/9/14
N2 - In this study, nanoindentation technology is applied to evaluate the elastic-plastic law of mechanical properties of small-sized in-situ packaging materials. As one of the most appealing advantage, the proposed method requires only a single nanoindentation, which means the nanoindentation experiments can be performed at minor effort. Combined with nanoindentation technology, the mechanical behavior of packaging materials in single-point nanoindentation loading process was simulated by the finite element method. The effect of surface stress on nanoindentation was studied numerically. In the finite element simulations, after applying prestress to the substrate material, the single-point nanoindentation was numerically analyzed up to the same indentation depth. Based on the finite element predictions, the mechanical properties of materials subjected to prestressing in different directions are studied. By comparing the applied load-penetration depth curves, stress contour, plastic zone and pile-up behavior, the influence of surface stress on the elastic-plastic material is elucidated.
AB - In this study, nanoindentation technology is applied to evaluate the elastic-plastic law of mechanical properties of small-sized in-situ packaging materials. As one of the most appealing advantage, the proposed method requires only a single nanoindentation, which means the nanoindentation experiments can be performed at minor effort. Combined with nanoindentation technology, the mechanical behavior of packaging materials in single-point nanoindentation loading process was simulated by the finite element method. The effect of surface stress on nanoindentation was studied numerically. In the finite element simulations, after applying prestress to the substrate material, the single-point nanoindentation was numerically analyzed up to the same indentation depth. Based on the finite element predictions, the mechanical properties of materials subjected to prestressing in different directions are studied. By comparing the applied load-penetration depth curves, stress contour, plastic zone and pile-up behavior, the influence of surface stress on the elastic-plastic material is elucidated.
KW - Berkovich indentation
KW - Nanoindentation
KW - surface stress
UR - http://www.scopus.com/inward/record.url?scp=85118461927&partnerID=8YFLogxK
U2 - 10.1109/ICEPT52650.2021.9568162
DO - 10.1109/ICEPT52650.2021.9568162
M3 - 会议稿件
AN - SCOPUS:85118461927
T3 - 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
BT - 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Y2 - 14 September 2021 through 17 September 2021
ER -