TY - GEN
T1 - Reliability Evaluation of Sintered AgNPs Strength Degradation
T2 - 24th International Conference on Electronic Packaging Technology, ICEPT 2023
AU - Wu, Zhaoxi
AU - Su, Yutai
AU - Duan, Chao
AU - Cheng, Xiaoran
AU - Long, Xu
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - A reliability evaluation framework for sintered silver nano-particles (AgNPs) is proposed, which have potential applications in next-generation power devices due to their excellent thermal conductivity, high melting point, and low sintering temperature. The proposed framework quantifies the microstructural evolution of sintered AgNPs layers with random porous structures and evaluates the strength degradation of the die-attachments. The approach involves determining the microstructural evolution of the random porous structure using the two-point probability function and random structure generation. The fracture processes and ultimate strengths of random samples are simulated based on the phase-field modeling. The statistical relationship between the strength values and aging time of the sintered AgNPs is calculated, and the strength degradations of sintered AgNPs under different aging time are evaluated. The probability distribution of non-failure case or the reliability distribution is calculated for the strength degradation of sintered AgNPs under thermal aging. The proposed framework enables a reliability assessment of the random porous structure and die-attachment strength degradation, providing a better understanding of the performance and reliability in high-temperature applications.
AB - A reliability evaluation framework for sintered silver nano-particles (AgNPs) is proposed, which have potential applications in next-generation power devices due to their excellent thermal conductivity, high melting point, and low sintering temperature. The proposed framework quantifies the microstructural evolution of sintered AgNPs layers with random porous structures and evaluates the strength degradation of the die-attachments. The approach involves determining the microstructural evolution of the random porous structure using the two-point probability function and random structure generation. The fracture processes and ultimate strengths of random samples are simulated based on the phase-field modeling. The statistical relationship between the strength values and aging time of the sintered AgNPs is calculated, and the strength degradations of sintered AgNPs under different aging time are evaluated. The probability distribution of non-failure case or the reliability distribution is calculated for the strength degradation of sintered AgNPs under thermal aging. The proposed framework enables a reliability assessment of the random porous structure and die-attachment strength degradation, providing a better understanding of the performance and reliability in high-temperature applications.
KW - die-attachment strength
KW - microstructural evolution
KW - reliability evaluation
KW - sintered AgNPs
KW - thermal aging
UR - http://www.scopus.com/inward/record.url?scp=85191695027&partnerID=8YFLogxK
U2 - 10.1109/ICEPT59018.2023.10492306
DO - 10.1109/ICEPT59018.2023.10492306
M3 - 会议稿件
AN - SCOPUS:85191695027
T3 - 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
BT - 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 8 August 2023 through 11 August 2023
ER -