Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates

Xu Long; Tianxiong Su; Chao Chang; Jiaqiang Huang; Xiaotong Chang; Yutai Su; Hongbin Shi; Tao Huang; Yanpei Wu

doi:10.1109/ICEPT52650.2021.9568200

Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates

Xu Long, Tianxiong Su, Chao Chang, Jiaqiang Huang, Xiaotong Chang, Yutai Su, Hongbin Shi, Tao Huang, Yanpei Wu

School of Mechanics,Civil Engineering and Architecture

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

While moving ahead with science and technology., the service conditions of microelectronic devices are becoming more and more complicated., and the performance requirements of packaging materials are also increasing especially for hash applications. The dependability of solder joints in electronic chips under high temperatures and high strain rates have attracted much attention. In this paper., experimental studies are carried out on the dynamic behavior of Sn-3.0Ag-0.5Cu (SAC305) materials. The dynamic compression experiments are operated by using the Split-Hopkinson Pressure Bar (SHPB) with a heating furnace to achieve the target temperature condition. The true stress- strain curves are received by this system at a temperature of 343K and the strain rates from 959 mathrms-1 to 1961 mathrms-1. Additionally., in order to investigate the deformation mechanism under impact scenarios., an optical microscopy is utilized to characterize the microstructure of the SAC305 lead-free solder specimen at high temperatures and high strain rates.

Original language	English
Title of host publication	2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665413916
DOIs	https://doi.org/10.1109/ICEPT52650.2021.9568200
State	Published - 14 Sep 2021
Event	22nd International Conference on Electronic Packaging Technology, ICEPT 2021 - Xiamen, China Duration: 14 Sep 2021 → 17 Sep 2021

Publication series

Name	2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

Conference

Conference	22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Country/Territory	China
City	Xiamen
Period	14/09/21 → 17/09/21

Keywords

Dynamic
microstructure
SHPB
strain rate
temperature

Access to Document

10.1109/ICEPT52650.2021.9568200

Cite this

Long, X., Su, T., Chang, C., Huang, J., Chang, X., Su, Y., Shi, H., Huang, T., & Wu, Y. (2021). Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates. In 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021 (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT52650.2021.9568200

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title = "Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates",

abstract = "While moving ahead with science and technology., the service conditions of microelectronic devices are becoming more and more complicated., and the performance requirements of packaging materials are also increasing especially for hash applications. The dependability of solder joints in electronic chips under high temperatures and high strain rates have attracted much attention. In this paper., experimental studies are carried out on the dynamic behavior of Sn-3.0Ag-0.5Cu (SAC305) materials. The dynamic compression experiments are operated by using the Split-Hopkinson Pressure Bar (SHPB) with a heating furnace to achieve the target temperature condition. The true stress- strain curves are received by this system at a temperature of 343K and the strain rates from 959 mathrms-1 to 1961 mathrms-1. Additionally., in order to investigate the deformation mechanism under impact scenarios., an optical microscopy is utilized to characterize the microstructure of the SAC305 lead-free solder specimen at high temperatures and high strain rates.",

keywords = "Dynamic, microstructure, SHPB, strain rate, temperature",

author = "Xu Long and Tianxiong Su and Chao Chang and Jiaqiang Huang and Xiaotong Chang and Yutai Su and Hongbin Shi and Tao Huang and Yanpei Wu",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 22nd International Conference on Electronic Packaging Technology, ICEPT 2021 ; Conference date: 14-09-2021 Through 17-09-2021",

year = "2021",

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doi = "10.1109/ICEPT52650.2021.9568200",

language = "英语",

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Long, X, Su, T, Chang, C, Huang, J, Chang, X, Su, Y, Shi, H, Huang, T & Wu, Y 2021, Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates. in 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, Institute of Electrical and Electronics Engineers Inc., 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, Xiamen, China, 14/09/21. https://doi.org/10.1109/ICEPT52650.2021.9568200

Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates. / Long, Xu; Su, Tianxiong; Chang, Chao et al.
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., 2021. (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates

AU - Long, Xu

AU - Su, Tianxiong

AU - Chang, Chao

AU - Huang, Jiaqiang

AU - Chang, Xiaotong

AU - Su, Yutai

AU - Shi, Hongbin

AU - Huang, Tao

AU - Wu, Yanpei

PY - 2021/9/14

Y1 - 2021/9/14

N2 - While moving ahead with science and technology., the service conditions of microelectronic devices are becoming more and more complicated., and the performance requirements of packaging materials are also increasing especially for hash applications. The dependability of solder joints in electronic chips under high temperatures and high strain rates have attracted much attention. In this paper., experimental studies are carried out on the dynamic behavior of Sn-3.0Ag-0.5Cu (SAC305) materials. The dynamic compression experiments are operated by using the Split-Hopkinson Pressure Bar (SHPB) with a heating furnace to achieve the target temperature condition. The true stress- strain curves are received by this system at a temperature of 343K and the strain rates from 959 mathrms-1 to 1961 mathrms-1. Additionally., in order to investigate the deformation mechanism under impact scenarios., an optical microscopy is utilized to characterize the microstructure of the SAC305 lead-free solder specimen at high temperatures and high strain rates.

AB - While moving ahead with science and technology., the service conditions of microelectronic devices are becoming more and more complicated., and the performance requirements of packaging materials are also increasing especially for hash applications. The dependability of solder joints in electronic chips under high temperatures and high strain rates have attracted much attention. In this paper., experimental studies are carried out on the dynamic behavior of Sn-3.0Ag-0.5Cu (SAC305) materials. The dynamic compression experiments are operated by using the Split-Hopkinson Pressure Bar (SHPB) with a heating furnace to achieve the target temperature condition. The true stress- strain curves are received by this system at a temperature of 343K and the strain rates from 959 mathrms-1 to 1961 mathrms-1. Additionally., in order to investigate the deformation mechanism under impact scenarios., an optical microscopy is utilized to characterize the microstructure of the SAC305 lead-free solder specimen at high temperatures and high strain rates.

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KW - microstructure

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ER -

Long X, Su T, Chang C, Huang J, Chang X, Su Y et al. Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates. In 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc. 2021. (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021). doi: 10.1109/ICEPT52650.2021.9568200

Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates

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