Exploring the Patent Landscape of Sintered Metal Technologies: An Analysis Using LLM-Based AI Patent Search

This study leveraged a proprietary Large Language Model (LLM) via app.amplified.ai, focusing on sintered metal technology patents for die-bonding uses in electronics packaging. This AI platform analyzed patent complexities, particularly examining 11 pre-selected patents with known activities on uses of silver or copper paste formulations as die-attach materials from companies like Infineon Technologies, Siemens, Nihon Superior Tanaka Kikinzoku, Heraeus, Hitachi and Alphametals. Following similarity assessments with these 11 pre-selected patents, 243 core patents were identified from the app.amplified.ai patent databases (of more than 150 million), retrieved and analyzed, resulting in six key clusters: 1) conductive adhesive bonding 2) metal particle bonding 3) porous metal bonding 4) sintered silver bonding, 5) substrate bonding methods 6) terminal management bonding. These clusters match the dominant Cooperative Patent Cooperation codes as follows: H01L24/83, H01L24/29 and H01L2224/8384; all methods related to connecting semiconductor using layer connector, and mainly with sintering technology.