每年的科研成果
每年的科研成果
搜索结果
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2025
Parametric Modeling Analysis and Lifetime Prediction of Large-Size Conductive Adhesive Bonding Layers
Li, W., Luo, A., Yang, L., Wu, Y., Liu, X., Wang, X., Su, Y. & Hu, T., 2025, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024 — International Conference on Computational and Experimental Engineering and Sciences ICCES. Zhou, K. (编辑). Springer Science and Business Media B.V., 页码 665-678 14 页码 (Mechanisms and Machine Science; 卷 175 MMS).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2024
Dynamic response of interconnects in board-level packaging structure at extremely high strain rates
Long, X., Hu, Y., Shi, H. & Su, Y., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 887-891 5 页码 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of Space Environment on the Reliability of Conductive Adhesive Joints
Ren, L., Wu, Y., Zhang, L., Gao, Y. & Long, X., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2023—Volume 3. Li, S. (编辑). Springer Science and Business Media B.V., 页码 975-983 9 页码 (Mechanisms and Machine Science; 卷 146).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Exploring the Patent Landscape of Sintered Metal Technologies: An Analysis Using LLM-Based AI Patent Search
Siow, K. S., Wang, W., Bahru, R., Long, X. & Lee, H. W., 2024, 2024 IEEE 40th International Electronics Manufacturing Technology, IEMT 2024. Institute of Electrical and Electronics Engineers Inc., (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Finite Element Modelling and Life Prediction of Solder Joints of Board Level Devices Under Power Cyclic Load
Luo, A., Wan, B., Su, Y. & Zhang, S., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024—Volume 1. Zhou, K. (编辑). Springer Science and Business Media B.V., 页码 153-164 12 页码 (Mechanisms and Machine Science; 卷 168 MMS).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Microcrack Detection and Localization in Laminated Packaging Structures Using Superlets and Lamb Wave Static Components
Long, X., Li, Y., Wang, J., Zhao, L., Yuan, W. & Gu, T., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 1042-1046 5 页码 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Optimal Design of Vibration and Thermal Reliability of Printed Circuit Board Mounting Components for Space Electronic Equipment
Fu, Y., Wang, S., Wang, Q., Liu, J., Long, X. & Li, K., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024—Volume 1. Zhou, K. (编辑). Springer Science and Business Media B.V., 页码 761-777 17 页码 (Mechanisms and Machine Science; 卷 168 MMS).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Physical information neural network-based mechanical response prediction for sintered nano-silver materials
Long, X., Ding, X., Shi, H., Su, Y. & Gu, T., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 1052-1055 4 页码 (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Review of Non-contact Blade Vibration Monitoring Based on Blade Tip Timing
Wang, F., Fu, C., Zheng, L., Lu, K. & Gu, F., 2024, Proceedings of the UNIfied Conference of DAMAS, IncoME and TEPEN Conferences (UNIfied 2023) - Volume 1. Ball, A. D., Wang, Z., Ouyang, H. & Sinha, J. K. (编辑). Springer Science and Business Media B.V., 页码 459-469 11 页码 (Mechanisms and Machine Science; 卷 151 MMS).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Robust Event-Triggered Model Predictive Control for Uncertain Linear Parameter-Varying Systems
Jiang, H., Guo, Y., Liu, T., Fan, Q. Y. & Lu, K., 2024, 2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024. Institute of Electrical and Electronics Engineers Inc., 页码 625-630 6 页码 (2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Strain Rate Effect on Indentation Behavior of Polycrystalline Sintered Silver Nanoparticles Based on Crystal Plasticity Finite Element Method
Long, X., Dong, R., Shi, H., Huang, T., Shao, Z. & Su, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Study on Dynamic Modeling and Vibration Noise Suppression Method of AUV
Zhang, K., Fu, C., Lu, K., Zhang, K., Cheng, H. & Guo, D., 2024, Advances in Applied Nonlinear Dynamics, Vibration, and Control – 2023 - The Proceedings of 2023 International Conference on Applied Nonlinear Dynamics, Vibration, and Control ICANDVC2023. Jing, X., Ding, H., Ji, J. & Yurchenko, D. (编辑). Springer Science and Business Media Deutschland GmbH, 页码 151-164 14 页码 (Lecture Notes in Electrical Engineering; 卷 1152).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Thermal Conductivity Simulation of Sintered Nano-Silver for High-Power Electronic Devices
Long, X., Zhao, X., Shi, H., Chang, C., Wang, Z. & Su, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024. Institute of Electrical and Electronics Engineers Inc., (2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2023
Dimensionless contact stiffness model to unveil the strain rate effect of nickel-based single crystal superalloy by nanoindentation
Shen, Z., Su, Y., Liang, Z. & Long, X., 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 747-750 4 页码 (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Dynamic Analysis of Four Point Contact Ball Bearings
Li, Z., Zhang, H. & Xie, Z., 2023, 2023 Global Reliability and Prognostics and Health Management Conference, PHM-Hangzhou 2023. Guo, W. & Li, S. (编辑). Institute of Electrical and Electronics Engineers Inc., (2023 Global Reliability and Prognostics and Health Management Conference, PHM-Hangzhou 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of cohesive behaviour and residual stress on the indentation response of elastoplastic film/substrate structure
Li, J. & Long, X., 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 829-833 5 页码 (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of current on the growth of intermetallic compounds in Sn-3.0Ag-0.5Cu solder joints
Li, B., Wang, J. & Yao, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Meso-scale crystal plasticity modeling of sintered silver nanoparticles in typical interconnected structures
Long, X., Chong, K., Chang, C. & Su, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Multidisciplinary Design Optimization Investigation of Air-Cooled Turbine Blade for Marine Gas Turbine
Niu, X., Lin, F., Li, X., Gao, M., Zhang, X., Li, L. & Gao, J., 2023, 2023 International Conference on Marine Equipment and Technology and Sustainable Development. Yang, D. (编辑). Springer Science and Business Media Deutschland GmbH, 页码 18-31 14 页码 (Lecture Notes in Civil Engineering; 卷 375 LNCE).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Reliability Evaluation of Sintered AgNPs Strength Degradation: Influence of Microstructural Evolution during Thermal Aging
Wu, Z., Su, Y., Duan, C., Cheng, X. & Long, X., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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The Array Optimization Model for Distributed Antisubmarine of Non-cluster USV Based on Coverage
Niu, Y., Zhang, K., Mu, Y., Wang, Q. & Wang, Y., 2023, Proceedings of 2022 International Conference on Autonomous Unmanned Systems, ICAUS 2022. Fu, W., Gu, M. & Niu, Y. (编辑). Springer Science and Business Media Deutschland GmbH, 页码 2402-2412 11 页码 (Lecture Notes in Electrical Engineering; 卷 1010 LNEE).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2022
An Improved Interpolation Algorithm for the Damped Signal Based on Hann Window
Xu, H., Zhou, S., Qin, W. & Litak, G., 2022, Proceedings - 2022 14th International Conference on Signal Processing Systems, ICSPS 2022. Institute of Electrical and Electronics Engineers Inc., 页码 269-277 9 页码 (Proceedings - 2022 14th International Conference on Signal Processing Systems, ICSPS 2022).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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EFFECT OF DEFLECTION ANGLE ON FLOW AND HEAT TRANSFER IN A ROTATING U-CHANNEL
Li, H., Li, L., Tang, Z., Zhang, Z. & Yuan, T., 2022, Heat Transfer - General Interest/Additive Manufacturing Impacts on Heat Transfer; Internal Air Systems; Internal Cooling. American Society of Mechanical Engineers (ASME), V06BT15A027. (Proceedings of the ASME Turbo Expo; 卷 6-B).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of surface energy on the bond strength of conductive adhesive
Zhu, Z., Xu, J., Yu, Z., Wang, J., Wu, H. & Long, X., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Equivalence of nanoindentations by the load and displacement controlled manners
Shen, Z., Dong, R., Chong, K., Liu, Y., Su, Y. & Long, X., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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PHASE-FIELD MODELLING FOR CRACK EVOLUTION OF PBX UNDER THERMOMECHANICAL LOADINGS
Long, X., Zhu, J., Su, Y., Siow, K. S. & Chen, C., 2022, Acoustics, Vibration, and Phononics. American Society of Mechanical Engineers (ASME), V001T01A009. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 1).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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PRACTICAL INSIGHT INTO INERTIAL ACTUATORS ARRANGEMENT OPTIMIZATION FOR ACTIVE CONTROL SYSTEMS
Wrona, S., Pawelczyk, M. & Xie, Z., 2022, Proceedings of the 28th International Congress on Sound and Vibration, ICSV 2022. Society of Acoustics, (Proceedings of the International Congress on Sound and Vibration).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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QUANTIFICATION AND PROPAGATION OF UNCERTAINTY IN CRITICAL SPEEDS AND MODE SHAPES OF ROTATING STRUCTURES
Luo, W., Fu, C., Lu, K. & Yang, Y., 2022, IET Conference Proceedings. 13 编辑 Institution of Engineering and Technology, 卷 2022. 页码 700-704 5 页码科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Rapid model generation and analysis of mechanical behaviour of electronic packaging structures by machine learning
Long, X., Ding, X., Su, Y., Liu, Y., Shi, H., Chen, W. & Tang, R., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Research on Airworthiness Qualification Test Technology of Radiation Emission in Civil Aircraft Flight Control Electronic System
Kuan, L., Aijun, L., Tianbo, W., Linxiao, L. & Jianyuan, W., 2022, Proceedings of the 5th China Aeronautical Science and Technology Conference. Springer Science and Business Media Deutschland GmbH, 页码 951-962 12 页码 (Lecture Notes in Electrical Engineering; 卷 821 LNEE).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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SEMI-ACTIVE CONTROL OF NONSTATIONARY NOISE TRANSMITTED THROUGH STRUCTURES
Wrona, S., Pawelczyk, M. & Xie, Z., 2022, Proceedings of the 28th International Congress on Sound and Vibration, ICSV 2022. Society of Acoustics, (Proceedings of the International Congress on Sound and Vibration).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Thermal effects on fracture behaviors of the die-attachment in the SiC power device under power cyclic conditions based on fracture phase-field modeling
Su, Y., Tu, B., Tang, R. & Long, X., 2022, 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2021
Determining mechanical properties of thin film in packaging structures by in-situ nanoindentation
Jia, Q., Shen, Z., Su, Y., Tang, R. & Long, X., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., 页码 616-619 4 页码 (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of cast and heat treatment processes on microstructure and properties of k4169 superalloy
Lian, Y. D., Gao, L. Q., Wang, P., Yin, Q., Hu, P. P. & Wen, Z. X., 2021, Metallurgy Technology and Materials VIII - Selected peer-reviewed full text papers from the 8th International Conference on Metallurgy Technology and Materials, ICMTM 2020. Mohamed, N. S. (编辑). Trans Tech Publications Ltd, 页码 25-30 6 页码 (Solid State Phenomena; 卷 315 SSP).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of Surface Stress on Indentation Response of Elastic-Plastic Materials
Long, X., Shen, Z., Chang, X., Su, Y., Shi, H., Huang, T., Wu, Y. & Tu, B., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Effect of Temperature on the Fatigue Damage of SAC305 Solder
Long, X., Guo, Y., Chang, X., Su, Y., Shi, H., Huang, T., Tu, B. & Wu, Y., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Fatigue behaviour of small-sized in-situ packaging materials based on a single-point nanoindentation with cyclic penetrations
Long, X., Li, J., Jia, Q., Shen, Z., Su, Y. & Tang, R., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., 页码 609-615 7 页码 (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Fatigue life of Ni-based single crystal super-alloy specimen with single hole
Xue, X., Wen, Z. & Li, W., 2021, Materials Science and Technologies. Li, Z. J. (编辑). Trans Tech Publications Ltd, 页码 10-16 7 页码 (Key Engineering Materials; 卷 891 KEM).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Growth kinetics of intermetallic compound in solder joints during thermal cycling: A review
Xu, J., Guo, Y., Su, Y., Tang, R. & Long, X., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., 页码 464-468 5 页码 (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Influences of the γ′ phase on the mechanical properties of a nickel-based single crystal superalloy
Wang, X. Y., Li, M. & Wen, Z. X., 2021, Material Science and Engineering Technology IX - Selected peer-reviewed full text papers from the 9th ICMSET 2020, 9th ICNNN 2020, and 5th ICMTA 2020. Agarwal, R. K. (编辑). Trans Tech Publications Ltd, 页码 45-52 8 页码 (Materials Science Forum; 卷 1023 MSF).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Investigation on stress and strain of ni-based single crystal super-alloy specimen with single hole based on abacus
Xue, X., Wen, Z. & Li, W., 2021, Materials Science and Technologies. Li, Z. J. (编辑). Trans Tech Publications Ltd, 页码 17-22 6 页码 (Key Engineering Materials; 卷 891 KEM).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates
Long, X., Su, T., Chang, C., Huang, J., Chang, X., Su, Y., Shi, H., Huang, T. & Wu, Y., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Numerical analysis on the leading edge film cooling of bifurcation holes for gas turbine blade
Tang, Z., Xie, G., Li, H., Gao, W., Tan, C. & Li, L., 2021, Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021. American Society of Mechanical Engineers (ASME), V001T04A003. (Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Numerical Simulation Analysis of Flexible Printed Circuits under Bending Conditions
Liu, Y., Wang, H., Hu, X., Peng, C., Long, X., Lu, J., Sun, R. & Wong, C. P., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Optimal design of novel laminated cooling system considering cooling effectiveness and thermomechanical performance
Li, H., Li, L., Gao, W., Tang, Z., Tan, C. & Ren, S., 2021, Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021. American Society of Mechanical Engineers (ASME), V001T04A002. (Proceedings of the ASME 2021 Heat Transfer Summer Conference, HT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling
Zhu, J., Su, Y., Chuantong, C., Siow, K. S., Tang, R. & Long, X., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021. Institute of Electrical and Electronics Engineers Inc., 页码 317-321 5 页码 (2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Sequential Analysis of Drop Impact and Thermal Cycling of Electronic Packaging Structures
Liu, Y., Long, X., Wang, H., Lu, J., Sun, R. & Wong, C. P., 14 9月 2021, 2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2020
Application of the Second Dimension Reduction Method in Nonlinear Rotor Dynamic System
Lu, K., Zhang, H., Zhou, H., Jin, Y., Yang, Y. & Fu, C., 2020, Nonlinear Dynamics of Structures, Systems and Devices - Proceedings of the 1st International Nonlinear Dynamics Conference, NODYCON 2019. Lacarbonara, W., Balachandran, B., Ma, J., Tenreiro Machado, J. A. & Stepan, G. (编辑). Springer Nature, 页码 533-548 16 页码 (Nonlinear Dynamics of Structures, Systems and Devices - Proceedings of the 1st International Nonlinear Dynamics Conference, NODYCON 2019).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Constitutive model and parameter identification for lead-free SAC305 solder
Long, X., Chen, Z. & Shi, H., 8月 2020, 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020. Institute of Electrical and Electronics Engineers Inc., 9202676. (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Micromorphology analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate
Xu, J., Chen, C. & Long, X., 2 12月 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers Inc., 页码 312-315 4 页码 9315063. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审