Physical information neural network-based mechanical response prediction for sintered nano-silver materials

Xu Long, Xiaoyue Ding, Hongbin Shi, Yutai Su, Tang Gu

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Deep learning approaches employing physics informed neural networks (PINNs) facilitate the modeling of agents and the analysis of mechanical properties in electronic packaging materials. Specifically, in the study of the mechanical behavior of sintered nano-silver materials, PINNs integrate momentum balance equations along with corresponding material constitutive models. The mechanical physics equations embedded in the PINN ensure that its output follows the laws of physics. The input data to the model are the coordinates of the position within the problem area, while the output data are the corresponding physical field components. Upon the completion of iterative training, the network effectively generates detailed displacement and stress-strain distributions for the material under displacement field loading. By embedding physical principles into the neural network, the accuracy and reliability of predictions for mechanical analysis are significantly enhanced, offering a robust framework for elucidating material behavior under diverse loading conditions.

源语言英语
主期刊名Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
编辑Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui
出版商Institute of Electrical and Electronics Engineers Inc.
1052-1055
页数4
ISBN(电子版)9798331522001
DOI
出版状态已出版 - 2024
活动26th Electronics Packaging Technology Conference, EPTC 2024 - Singapore, 新加坡
期限: 3 12月 20246 12月 2024

出版系列

姓名Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024

会议

会议26th Electronics Packaging Technology Conference, EPTC 2024
国家/地区新加坡
Singapore
时期3/12/246/12/24

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