Strain Rate Effect on Indentation Behavior of Polycrystalline Sintered Silver Nanoparticles Based on Crystal Plasticity Finite Element Method

Xu Long, Ruipeng Dong, Hongbin Shi, Tao Huang, Zhaoshen Shao, Yutai Su

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

Based on crystal plasticity finite element simulation, this study explores the meso-scale mechanical behavior of polycrystalline sintered silver nanoparticles (AgNPs) under different strain rates and indentation depths using the nanoindentation method. A three-dimensional finite element indentation model of polycrystalline sintered AgNPs was constructed in ABAQUS, and the mechanical behavior of the polycrystalline sintered AgNPs was investigated under different indentation depths (500nm, 100nm, and 2000nm) and strain rates (0.05s-1,0.1s-1, and 0.2s-1) conditions for indentation tests. As the representative parameters, the material properties, such as load-displacement curves, hardness, cumulative shear strain and the crystal orientation, were investigated. The experimental results show that the effect of indentation strain rate on the load-displacement curve is obvious, and the applied load on the indenter increases with the increase of strain rate. This underlines the strain rate effect of sintered AgNPs at the mesoscopic scale. In addition, the indentation strain rate and hardness are significantly associated in a linear relationship, indicating that the hardness is extremely sensitive to the indentation strain rate, and thus the plastic deformation behavior is significantly affected by the loading rate.

源语言英语
主期刊名2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798350353808
DOI
出版状态已出版 - 2024
活动25th International Conference on Electronic Packaging Technology, ICEPT 2024 - Tianjin, 中国
期限: 7 8月 20249 8月 2024

出版系列

姓名2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024

会议

会议25th International Conference on Electronic Packaging Technology, ICEPT 2024
国家/地区中国
Tianjin
时期7/08/249/08/24

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