Ultrasound assisted solidification process of ternary Cu-Sn-Sb alloy

Wei Zhai, Zhenyu Hong, Haiman Liu, Bingbo Wei

科研成果: 期刊稿件文章同行评审

4 引用 (Scopus)

指纹

探究 'Ultrasound assisted solidification process of ternary Cu-Sn-Sb alloy' 的科研主题。它们共同构成独一无二的指纹。

Physics

Engineering

Material Science