Ultrasound assisted solidification process of ternary Cu-Sn-Sb alloy

Wei Zhai, Zhenyu Hong, Haiman Liu, Bingbo Wei

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Fingerprint

Dive into the research topics of 'Ultrasound assisted solidification process of ternary Cu-Sn-Sb alloy'. Together they form a unique fingerprint.

Physics

Engineering

Material Science