Thermal fatigue life of Sn-3.0Ag-0.5Cu solder joint under temperature cycling coupled with electric current

Xu Long, Yongchao Liu, Fengrui Jia, Yanpei Wu, Yonghui Fu, Cheng Zhou

科研成果: 期刊稿件 › 文章 › 同行评审

24 引用 （Scopus）

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Material Science

Engineering