Thermal fatigue life of Sn-3.0Ag-0.5Cu solder joint under temperature cycling coupled with electric current

Xu Long, Yongchao Liu, Fengrui Jia, Yanpei Wu, Yonghui Fu, Cheng Zhou

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Fingerprint

Dive into the research topics of 'Thermal fatigue life of Sn-3.0Ag-0.5Cu solder joint under temperature cycling coupled with electric current'. Together they form a unique fingerprint.

Material Science

Engineering