Thermal cyclic test safety analysis method for astronautic electronic products based on PoF

Yutai Su, Guicui Fu, Hantian Gu, Bo Wan

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

Thermal cyclic test is very important for astronautic electronic products to stimulate potentially critical failures and eliminate latent defects. The design of the thermal cyclic test should take the safety of test into account to avoid over-test risks. Over-test risks can cause serious consequences, such as unnecessary life cycle consumption and products failure. A method presented in this paper based on PoF can evaluate the over-test risk of the test scheme in life cycle and provide some guidance for the design of the test including temperature range, number of cycles and dwell time. Additionally, aiming at a signal acquisition board, the different schemes were analyzed and some suggestions were offered to modify the scheme.

源语言英语
主期刊名Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014
出版商Institute of Electrical and Electronics Engineers Inc.
79-82
页数4
ISBN(电子版)9781479979585
DOI
出版状态已出版 - 16 12月 2014
已对外发布
活动2014 Prognostics and System Health Management Conference, PHM 2014 - Zhangiiaijie City, 中国
期限: 24 8月 201427 8月 2014

出版系列

姓名Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014

会议

会议2014 Prognostics and System Health Management Conference, PHM 2014
国家/地区中国
Zhangiiaijie City
时期24/08/1427/08/14

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