Thermal cyclic test safety analysis method for astronautic electronic products based on PoF

Yutai Su, Guicui Fu, Hantian Gu, Bo Wan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Thermal cyclic test is very important for astronautic electronic products to stimulate potentially critical failures and eliminate latent defects. The design of the thermal cyclic test should take the safety of test into account to avoid over-test risks. Over-test risks can cause serious consequences, such as unnecessary life cycle consumption and products failure. A method presented in this paper based on PoF can evaluate the over-test risk of the test scheme in life cycle and provide some guidance for the design of the test including temperature range, number of cycles and dwell time. Additionally, aiming at a signal acquisition board, the different schemes were analyzed and some suggestions were offered to modify the scheme.

Original languageEnglish
Title of host publicationProceedings of 2014 Prognostics and System Health Management Conference, PHM 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages79-82
Number of pages4
ISBN (Electronic)9781479979585
DOIs
StatePublished - 16 Dec 2014
Externally publishedYes
Event2014 Prognostics and System Health Management Conference, PHM 2014 - Zhangiiaijie City, China
Duration: 24 Aug 201427 Aug 2014

Publication series

NameProceedings of 2014 Prognostics and System Health Management Conference, PHM 2014

Conference

Conference2014 Prognostics and System Health Management Conference, PHM 2014
Country/TerritoryChina
CityZhangiiaijie City
Period24/08/1427/08/14

Keywords

  • life cycle
  • PoF
  • test safety
  • thermal cyclic test

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