TY - GEN
T1 - The Fabrication Method of High Height-to-Diameter Ratio Micro-Wineglass Resonators∗
AU - Xie, Jianbing
AU - Ren, Sen
AU - Shen, Qiang
AU - Chen, Lei
AU - Xie, Hui
AU - Yuan, Weizheng
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/20
Y1 - 2018/8/20
N2 - This paper presents the fabrication of High Height-to-Diameter Ratio Micro-Wineglass Resonators using glassblowing with thermal decomposition process. CaCO3 is used as the thermal decomposition material in this process in this paper. A number of chips with deep cavities are fabricated and loaded with different doses of CaCO3. The experiment results show that, the deep cavity can blowing a glass spherical shell with the H/DR of 0.79, which is better than the deep cavity glassblowing process without thermal decomposition.
AB - This paper presents the fabrication of High Height-to-Diameter Ratio Micro-Wineglass Resonators using glassblowing with thermal decomposition process. CaCO3 is used as the thermal decomposition material in this process in this paper. A number of chips with deep cavities are fabricated and loaded with different doses of CaCO3. The experiment results show that, the deep cavity can blowing a glass spherical shell with the H/DR of 0.79, which is better than the deep cavity glassblowing process without thermal decomposition.
KW - Glassblowing
KW - Height-to-Diameter Ratio
KW - Hemispherical Resonator Gyroscopes
KW - Micro-Wineglass Resonators
KW - Thermal Decomposition
UR - http://www.scopus.com/inward/record.url?scp=85053496423&partnerID=8YFLogxK
U2 - 10.1109/INEC.2018.8441927
DO - 10.1109/INEC.2018.8441927
M3 - 会议稿件
AN - SCOPUS:85053496423
SN - 9781538642504
T3 - 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018
SP - 45
EP - 46
BT - 2018 IEEE 8th International Nanoelectronics Conferences, INEC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 8th IEEE International Nanoelectronics Conferences, INEC 2018
Y2 - 3 January 2018 through 5 January 2018
ER -