摘要
Three-dimensional C/SiC was successfully joined to niobium alloy with a Ti-Cu bi-foil interlayer by a two-stage joining process: at 800 °C for 30 min under 6 MPa and at 1020 °C for 8-120 min under 0.01-0.05 MPa. The results showed that the residual Cu layer at the joining interface relaxed the thermal stress of the joint effectively, and the Ti-Cu eutectic liquid, formed by the contact melting of Ti-Cu, not only infiltrated into C/SiC, but also reacted with the SiC coating of C/SiC. These characteristics were beneficial to the joint, of which the shear strength was as high as 34.1 MPa.
源语言 | 英语 |
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页(从-至) | 151-154 |
页数 | 4 |
期刊 | Scripta Materialia |
卷 | 55 |
期 | 2 |
DOI | |
出版状态 | 已出版 - 7月 2006 |