Joining of 3D C/SiC composites to niobium alloy

Jiangtao Xiong, Jinglong Li, Fusheng Zhang, Weidong Huang

Research output: Contribution to journalArticlepeer-review

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Abstract

Three-dimensional C/SiC was successfully joined to niobium alloy with a Ti-Cu bi-foil interlayer by a two-stage joining process: at 800 °C for 30 min under 6 MPa and at 1020 °C for 8-120 min under 0.01-0.05 MPa. The results showed that the residual Cu layer at the joining interface relaxed the thermal stress of the joint effectively, and the Ti-Cu eutectic liquid, formed by the contact melting of Ti-Cu, not only infiltrated into C/SiC, but also reacted with the SiC coating of C/SiC. These characteristics were beneficial to the joint, of which the shear strength was as high as 34.1 MPa.

Original languageEnglish
Pages (from-to)151-154
Number of pages4
JournalScripta Materialia
Volume55
Issue number2
DOIs
StatePublished - Jul 2006

Keywords

  • C/SiC composites
  • CMC
  • Joining
  • Niobium alloy

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