Improvement for electrical conductivity of Ti₃SiC₂/Cu joint brazed with a novel Sn₆Ag₇Ni₄Co₂Ti low-melting high entropy alloy filler

Reducing the interfacial electrical resistance of Ti₃SiC₂/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn₆Ag₇Ni₄Co₂Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti₃SiC₂/Cu brazed joint was obtained using above filler. The interface of Ti₃SiC₂/Cu joint brazed with Sn₆Ag₇Ni₄Co₂Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)₂Si. Compared with Ti₃SiC₂/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn₆Ag₇Ni₄Co₂Ti filler is lower at all test temperatures, which is reduced by up to 15.99% when the test temperature is 300 °C.