Effect of directional solidification rates on the interface morphology and dendrite growth of the hypoeutectic Cu-1.0wt%Cr alloy

Effect of directional solidification rates on interface morphology and dendrite growth of the hypoeutectic Cu-1.0wt% Cr alloy was investigated. The results show that the interface morphology of a primary phase undergoes the evolution from plane front, cellular, thick dendrite to thin dendrite with increasing of solidification rates for a given temperature gradient. The first dendrite spacing λ₁ of primary α phase increases gradually during the cellular growth, and decreases during the dendrite growth. The second dendrite spacing λ₂ decreases with increase of the solidification rates.