Effect of directional solidification rates on the interface morphology and dendrite growth of the hypoeutectic Cu-1.0wt%Cr alloy

Rui Hu, Qi Wu He, Yi Chuan Wang, Hong Chao Kou, Jin Shan Li, Xiao Qin Bi, Heng Zhi Fu

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Effect of directional solidification rates on interface morphology and dendrite growth of the hypoeutectic Cu-1.0wt% Cr alloy was investigated. The results show that the interface morphology of a primary phase undergoes the evolution from plane front, cellular, thick dendrite to thin dendrite with increasing of solidification rates for a given temperature gradient. The first dendrite spacing λ1 of primary α phase increases gradually during the cellular growth, and decreases during the dendrite growth. The second dendrite spacing λ2 decreases with increase of the solidification rates.

Original languageEnglish
Pages (from-to)33-35
Number of pages3
JournalCailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment
Volume27
Issue number1
StatePublished - Feb 2006

Keywords

  • Cu-Cr alloy
  • Dendrite growth
  • Directional solidification
  • S/L interface

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