Abstract
Effect of directional solidification rates on interface morphology and dendrite growth of the hypoeutectic Cu-1.0wt% Cr alloy was investigated. The results show that the interface morphology of a primary phase undergoes the evolution from plane front, cellular, thick dendrite to thin dendrite with increasing of solidification rates for a given temperature gradient. The first dendrite spacing λ1 of primary α phase increases gradually during the cellular growth, and decreases during the dendrite growth. The second dendrite spacing λ2 decreases with increase of the solidification rates.
Original language | English |
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Pages (from-to) | 33-35 |
Number of pages | 3 |
Journal | Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment |
Volume | 27 |
Issue number | 1 |
State | Published - Feb 2006 |
Keywords
- Cu-Cr alloy
- Dendrite growth
- Directional solidification
- S/L interface