摘要
The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.
| 源语言 | 英语 |
|---|---|
| 页（从-至） | 366-369 |
| 页数 | 4 |
| 期刊 | Journal of Materials Processing Technology |
| 卷 | 205 |
| 期 | 1-3 |
| DOI | |
| 出版状态 | 已出版 - 26 8月 2008 |