Aging study of rapidly solidified and solid-solution Cu-Cr-Sn-Zn alloy

Juan hua Su; Ping Liu; Qi ming Dong; He jun Li; Feng zhang Ren

doi:10.1016/j.jmatprotec.2007.11.184

Aging study of rapidly solidified and solid-solution Cu-Cr-Sn-Zn alloy

Juan hua Su, Ping Liu, Qi ming Dong, He jun Li, Feng zhang Ren

School of Materials Sience and Engineering

Henan University of Science and Technology

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.

Original language	English
Pages (from-to)	366-369
Number of pages	4
Journal	Journal of Materials Processing Technology
Volume	205
Issue number	1-3
DOIs	https://doi.org/10.1016/j.jmatprotec.2007.11.184
State	Published - 26 Aug 2008

Keywords

Cu-Cr-Sn-Zn alloy
Microstructure
Properties
Rapidly solidified aging
Solid-solution aging

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10.1016/j.jmatprotec.2007.11.184

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title = "Aging study of rapidly solidified and solid-solution Cu-Cr-Sn-Zn alloy",

abstract = "The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.",

keywords = "Cu-Cr-Sn-Zn alloy, Microstructure, Properties, Rapidly solidified aging, Solid-solution aging",

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T1 - Aging study of rapidly solidified and solid-solution Cu-Cr-Sn-Zn alloy

AU - Su, Juan hua

AU - Liu, Ping

AU - Dong, Qi ming

AU - Li, He jun

AU - Ren, Feng zhang

PY - 2008/8/26

Y1 - 2008/8/26

N2 - The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.

AB - The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.

KW - Cu-Cr-Sn-Zn alloy

KW - Microstructure

KW - Properties

KW - Rapidly solidified aging

KW - Solid-solution aging

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Aging study of rapidly solidified and solid-solution Cu-Cr-Sn-Zn alloy

Abstract

Keywords

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