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Microstructure and Thermal Conductivity of the As-Cast and Annealed Al–Cu–Mg–Si Alloys in the Temperature Range from 25∘C to 400∘C
Cong Zhang, Yong Du, Shuhong Liu, Shaojun Liu, Wanqi Jie, Bosse Sundman
Research output: Contribution to journal › Article › peer-review