Improvement for electrical conductivity of Ti3SiC2/Cu joint brazed with a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy filler

Xin Nai, Haiyan Chen, Shuai Zhao, Fenjun Liu, Zhikang Shen, Wenya Li

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

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