TY - GEN
T1 - Ambient pressure drift rejection of mode-localized resonant sensors
AU - Zhang, Hemin
AU - Zhong, Jiming
AU - Yuan, Weizheng
AU - Yang, Jing
AU - Chang, Honglong
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - This paper experimentally demonstrates the ambient pressure drift rejection capability in the full measurement range of the mode-localized sensors. Based on a mode-localized resonant stiffness sensor, the experimental results show that the maximum measurement error of the amplitude ratio readout is ∼2.74% whereas that of the frequency readout is ∼21.63% with a pressure range of [2.6, 20] Pa. And the amplitude ratio based sensitivity is averagely ∼1970.3 times higher than the frequency based sensitivity. It can be concluded that the mode-localized sensors can not only amplify the sensitivity but also reject the ambient pressure drift.
AB - This paper experimentally demonstrates the ambient pressure drift rejection capability in the full measurement range of the mode-localized sensors. Based on a mode-localized resonant stiffness sensor, the experimental results show that the maximum measurement error of the amplitude ratio readout is ∼2.74% whereas that of the frequency readout is ∼21.63% with a pressure range of [2.6, 20] Pa. And the amplitude ratio based sensitivity is averagely ∼1970.3 times higher than the frequency based sensitivity. It can be concluded that the mode-localized sensors can not only amplify the sensitivity but also reject the ambient pressure drift.
UR - http://www.scopus.com/inward/record.url?scp=85015747586&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2017.7863604
DO - 10.1109/MEMSYS.2017.7863604
M3 - 会议稿件
AN - SCOPUS:85015747586
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1095
EP - 1098
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -