平纹编织 SiCf/SiC 复合材料的中温蠕变断裂时间及损伤机制

Translated title of the contribution: Creep rupture time and damage mechanisms of a plain woven SiCf/SiC composite at intermediate temperature

Siyu Zhu, Qiaojun Zhang, Zhiliang Hong, Kaikai Jing, Haoyang Guan, Zanlin Cheng, Yongsheng Liu, Bo Wang, Chengyu Zhang

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Fingerprint

Dive into the research topics of 'Creep rupture time and damage mechanisms of a plain woven SiCf/SiC composite at intermediate temperature'. Together they form a unique fingerprint.

Engineering

Material Science