TY - GEN
T1 - Wrinkled Microelectrode Interface Based on Oil-Pretreated Hyperelastic Substrate
AU - Ji, Bowen
AU - Wang, Minghao
AU - Guo, Zhejun
AU - Hong, Wen
AU - Wang, Longchun
AU - Wang, Xiaolin
AU - Yang, Bin
AU - Wang, Wei
AU - Liu, Jingquan
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - This paper reports a unique fabrication method to obtain wrinkled microelectrodes with different surface morphologies based on different hyperelastic substrates for the first time. The wrinkle microstructures are enhanced by mixture silicone oil in the uncured poly (dimethyl siloxane) (PDMS) or Ecoflex polymer followed by oil-extraction in chloroform and depositing 5\ \mu \mathrm{m} Parylene-C film. The wrinkle amplitude of the oil-pretreated PDMS and Ecoflex with Parylene-C top layer show 5-fold and 125-fold increase than the unpretreated ones, respectively. Besides, the wrinkled 3D microelectrode surface distinctly exhibits greater electrochemical properties than the flat 2D one, with impedance decreases of 29.2% and 38.9% for the oil-pretreated PDMS and Ecoflex elastomer.
AB - This paper reports a unique fabrication method to obtain wrinkled microelectrodes with different surface morphologies based on different hyperelastic substrates for the first time. The wrinkle microstructures are enhanced by mixture silicone oil in the uncured poly (dimethyl siloxane) (PDMS) or Ecoflex polymer followed by oil-extraction in chloroform and depositing 5\ \mu \mathrm{m} Parylene-C film. The wrinkle amplitude of the oil-pretreated PDMS and Ecoflex with Parylene-C top layer show 5-fold and 125-fold increase than the unpretreated ones, respectively. Besides, the wrinkled 3D microelectrode surface distinctly exhibits greater electrochemical properties than the flat 2D one, with impedance decreases of 29.2% and 38.9% for the oil-pretreated PDMS and Ecoflex elastomer.
UR - http://www.scopus.com/inward/record.url?scp=85074340339&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2019.8870820
DO - 10.1109/MEMSYS.2019.8870820
M3 - 会议稿件
AN - SCOPUS:85074340339
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 561
EP - 564
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -