TY - GEN
T1 - V-band Transceiver Based on Through Silicon Via (TSV) Technique
AU - Gao, Yanhong
AU - Chen, Dongbo
AU - Zhou, Shigang
AU - Lu, Xilong
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - A V-band three-dimensional silicon based transceiver SIP (System in Package) is presented in this paper, which is manufactured using high-precision Micro-Electro-Mechanical Systems (MEMS) technology and integrates low-loss Through-Silicon Via (TSV) vertical interconnection structures. Mixer, Low Noise Amplifier (LNA), and attenuator are contained in the receiver module while the power amplifier (PA), multiplier and attenuator are contained in the transmitter module. The size of the transmitter and receiver modules are 10×10×1mm3 and 12×11×1mm3 respectively. Measured results show that both the transmitter and receiver can cover the bandwidth of 59-62GHz with VSWR less than 2.0. The receiver gain can be up to 35dB and the transmitter out put power can be more than 15dBm in the frequency band.
AB - A V-band three-dimensional silicon based transceiver SIP (System in Package) is presented in this paper, which is manufactured using high-precision Micro-Electro-Mechanical Systems (MEMS) technology and integrates low-loss Through-Silicon Via (TSV) vertical interconnection structures. Mixer, Low Noise Amplifier (LNA), and attenuator are contained in the receiver module while the power amplifier (PA), multiplier and attenuator are contained in the transmitter module. The size of the transmitter and receiver modules are 10×10×1mm3 and 12×11×1mm3 respectively. Measured results show that both the transmitter and receiver can cover the bandwidth of 59-62GHz with VSWR less than 2.0. The receiver gain can be up to 35dB and the transmitter out put power can be more than 15dBm in the frequency band.
KW - Micro-Electro-Mechanical Systems (MEMS)
KW - System-in-Package (SiP)
KW - V-band
UR - http://www.scopus.com/inward/record.url?scp=85205714391&partnerID=8YFLogxK
U2 - 10.1109/ICEICT61637.2024.10670747
DO - 10.1109/ICEICT61637.2024.10670747
M3 - 会议稿件
AN - SCOPUS:85205714391
T3 - 2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024
SP - 378
EP - 380
BT - 2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th IEEE International Conference on Electronic Information and Communication Technology, ICEICT 2024
Y2 - 31 July 2024 through 2 August 2024
ER -