The design of radiation resistant flip-flop unit based on commercial process

Shao Xi Wang; Kang Wang; Xiao Ya Fan; Sheng Bing Zhang

The design of radiation resistant flip-flop unit based on commercial process

Shao Xi Wang, Kang Wang, Xiao Ya Fan, Sheng Bing Zhang

微电子学院

Northwestern Polytechnical University Xian

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.

源语言	英语
页（从-至）	79-84
页数	6
期刊	Hedianzixue Yu Tance Jishu/Nuclear Electronics and Detection Technology
卷	33
期	1
出版状态	已出版 - 1月 2013

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title = "The design of radiation resistant flip-flop unit based on commercial process",

abstract = "Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.",

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N2 - Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.

AB - Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.

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The design of radiation resistant flip-flop unit based on commercial process

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