The design of radiation resistant flip-flop unit based on commercial process

Shao Xi Wang, Kang Wang, Xiao Ya Fan, Sheng Bing Zhang

Research output: Contribution to journalArticlepeer-review

Abstract

Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.

Original languageEnglish
Pages (from-to)79-84
Number of pages6
JournalHedianzixue Yu Tance Jishu/Nuclear Electronics and Detection Technology
Volume33
Issue number1
StatePublished - Jan 2013

Keywords

  • Commercial process
  • Flip-flop
  • Radiation resistant

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