Abstract
Radiation resistant chip based on commercial semiconductor process can be achieved by modifying the circuit diagram and the layout topology of a chip. In the paper, four technologies such as double interlock cell, Triple Modular Redundancy, and RC filter have been analyzed. Combining the four technologies, a novel radiation resistant D flip flop has been designed. At last, and simulation have been adopted to demonstrate the performance of its radiation resistivity.
Original language | English |
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Pages (from-to) | 79-84 |
Number of pages | 6 |
Journal | Hedianzixue Yu Tance Jishu/Nuclear Electronics and Detection Technology |
Volume | 33 |
Issue number | 1 |
State | Published - Jan 2013 |
Keywords
- Commercial process
- Flip-flop
- Radiation resistant