@inproceedings{3ca4ab8bb87649de8ca16d7eff2950e0,
title = "Study on the preparation of 2-phenyl imidazole microcapsule and its effect on curing epoxy resin",
abstract = "In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester(PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope(SEM) and fourier transform infrared spectrum(FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.",
keywords = "2-phenyl imidazole, Curing, Epoxy, Microcapsule",
author = "Ma, {Ai Jie} and Zhang, {Qiu Yu} and Shi, {You Qiang}",
year = "2013",
doi = "10.4028/www.scientific.net/AMR.690-693.1649",
language = "英语",
isbn = "9783037856925",
series = "Advanced Materials Research",
pages = "1649--1652",
booktitle = "Materials Design, Processing and Applications",
note = "4th International Conference on Manufacturing Science and Engineering, ICMSE 2013 ; Conference date: 30-03-2013 Through 31-03-2013",
}