Study on the preparation of 2-phenyl imidazole microcapsule and its effect on curing epoxy resin

Ai Jie Ma, Qiu Yu Zhang, You Qiang Shi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester(PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope(SEM) and fourier transform infrared spectrum(FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

Original languageEnglish
Title of host publicationMaterials Design, Processing and Applications
Pages1649-1652
Number of pages4
DOIs
StatePublished - 2013
Event4th International Conference on Manufacturing Science and Engineering, ICMSE 2013 - Dalian, China
Duration: 30 Mar 201331 Mar 2013

Publication series

NameAdvanced Materials Research
Volume690 693
ISSN (Print)1022-6680

Conference

Conference4th International Conference on Manufacturing Science and Engineering, ICMSE 2013
Country/TerritoryChina
CityDalian
Period30/03/1331/03/13

Keywords

  • 2-phenyl imidazole
  • Curing
  • Epoxy
  • Microcapsule

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