On the characteristics of Si micro-fabrication by direct etching of excimer laser

Weizheng Yuan; Binghe Ma; Xiaoying Li; Tiejun Li; Lige Wang; Jingru Liu

doi:10.3901/jme.2000.03.107

On the characteristics of Si micro-fabrication by direct etching of excimer laser

Weizheng Yuan, Binghe Ma, Xiaoying Li, Tiejun Li, Lige Wang, Jingru Liu

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

The characteristics of Si micro-fabrication for MEMS by direct etching of KrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can reflect the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed.

源语言	英语
页（从-至）	107-110
页数	4
期刊	Jixie Gongcheng Xuebao/Journal of Mechanical Engineering
卷	36
期	3
DOI	https://doi.org/10.3901/jme.2000.03.107
出版状态	已出版 - 2000

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title = "On the characteristics of Si micro-fabrication by direct etching of excimer laser",

abstract = "The characteristics of Si micro-fabrication for MEMS by direct etching of KrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can reflect the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed.",

author = "Weizheng Yuan and Binghe Ma and Xiaoying Li and Tiejun Li and Lige Wang and Jingru Liu",

year = "2000",

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T1 - On the characteristics of Si micro-fabrication by direct etching of excimer laser

AU - Yuan, Weizheng

AU - Ma, Binghe

AU - Li, Xiaoying

AU - Li, Tiejun

AU - Wang, Lige

AU - Liu, Jingru

PY - 2000

Y1 - 2000

N2 - The characteristics of Si micro-fabrication for MEMS by direct etching of KrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can reflect the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed.

AB - The characteristics of Si micro-fabrication for MEMS by direct etching of KrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can reflect the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed.

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U2 - 10.3901/jme.2000.03.107

DO - 10.3901/jme.2000.03.107

M3 - 文章

AN - SCOPUS:0033903842

SN - 0577-6686

VL - 36

SP - 107

EP - 110

JO - Jixie Gongcheng Xuebao/Journal of Mechanical Engineering

JF - Jixie Gongcheng Xuebao/Journal of Mechanical Engineering

IS - 3

ER -

On the characteristics of Si micro-fabrication by direct etching of excimer laser

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