Numerical simulation of heat transfer characteristic of double-layer Y-shaped microchannel heat sink

With the reduction of the computer space, electronic chips are bound to endure higher heat fluxes. While double-layer microchannel heat sink compared with single-layer microchannel heat sink can improve the temperature uniformity of electric-chip significantly. The traditional air-cooling methods cannot satisfy the requirement of excessive thermal loads above 25w/mm². Therefore, a double-layer Y-shaped bifurcation water-cooling microchannel was designed for cooling the heat sink. The pressure drop and the laminar heat transfer performance of double-layer Y-shaped bifurcation have been discussed numerically. Results reveal that with the same convective surface area, the Y-shaped bifurcation can improve the heat transfer performance of the heat sink and decrease the pressure drop through the microchannel at the same pumping power. Moreover, the geometry parameters of Y-shaped double-layer microchannel are optimized to improve the thermal performance of heat sink, including bifurcation angle and the bifurcation number. The bifurcation angle is 60 and the bifurcation number is 2.