Numerical simulation of heat transfer characteristic of double-layer Y-shaped microchannel heat sink

Zhijian Duan, Gongnan Xie, Guohua Zhang, Xin Jin

Research output: Contribution to journalConference articlepeer-review

Abstract

With the reduction of the computer space, electronic chips are bound to endure higher heat fluxes. While double-layer microchannel heat sink compared with single-layer microchannel heat sink can improve the temperature uniformity of electric-chip significantly. The traditional air-cooling methods cannot satisfy the requirement of excessive thermal loads above 25w/mm2. Therefore, a double-layer Y-shaped bifurcation water-cooling microchannel was designed for cooling the heat sink. The pressure drop and the laminar heat transfer performance of double-layer Y-shaped bifurcation have been discussed numerically. Results reveal that with the same convective surface area, the Y-shaped bifurcation can improve the heat transfer performance of the heat sink and decrease the pressure drop through the microchannel at the same pumping power. Moreover, the geometry parameters of Y-shaped double-layer microchannel are optimized to improve the thermal performance of heat sink, including bifurcation angle and the bifurcation number. The bifurcation angle is 60 and the bifurcation number is 2.

Original languageEnglish
Pages (from-to)3425-3432
Number of pages8
JournalInternational Heat Transfer Conference
Volume2018-August
DOIs
StatePublished - 2018
Event16th International Heat Transfer Conference, IHTC 2018 - Beijing, China
Duration: 10 Aug 201815 Aug 2018

Keywords

  • Convection
  • Heat sink
  • Heat transfer enhancement
  • Micro scale measurement and simulation
  • Y-shaped microchannel

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