Modeling of rapidly solidified aging process of Cu-Cr-Sn-Zn alloy by an artificial neural network

Juan Hua Su, He Jun Li, Qi Ming Dong, Ping Liu, Bao Hong Tian

科研成果: 期刊稿件文章同行评审

7 引用 (Scopus)

摘要

This paper uses an artificial neural network (ANN) and Levenberg-Marquardt training algorithm to model the non-linear relationship between parameters of rapidly solidified aging processes and mechanical and electrical properties of Cu-Cr-Sn-Zn alloy. The predicted values of the ANN are in accordance with the testing data. A basic repository on the domain knowledge of rapidly solidified age processes is established. Rapidly solidified aging processes can greatly enhance the hardness and electrical conductivity for Cu-Cr-Sn-Zn alloy. At 500 °C for 15 min aging the hardness and conductivity can reach 170 HV and 64% IACS respectively.

源语言英语
页(从-至)151-156
页数6
期刊Computational Materials Science
34
2
DOI
出版状态已出版 - 9月 2005

指纹

探究 'Modeling of rapidly solidified aging process of Cu-Cr-Sn-Zn alloy by an artificial neural network' 的科研主题。它们共同构成独一无二的指纹。

引用此