Modeling of rapidly solidified aging process of Cu-Cr-Sn-Zn alloy by an artificial neural network

Juan Hua Su, He Jun Li, Qi Ming Dong, Ping Liu, Bao Hong Tian

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

This paper uses an artificial neural network (ANN) and Levenberg-Marquardt training algorithm to model the non-linear relationship between parameters of rapidly solidified aging processes and mechanical and electrical properties of Cu-Cr-Sn-Zn alloy. The predicted values of the ANN are in accordance with the testing data. A basic repository on the domain knowledge of rapidly solidified age processes is established. Rapidly solidified aging processes can greatly enhance the hardness and electrical conductivity for Cu-Cr-Sn-Zn alloy. At 500 °C for 15 min aging the hardness and conductivity can reach 170 HV and 64% IACS respectively.

Original languageEnglish
Pages (from-to)151-156
Number of pages6
JournalComputational Materials Science
Volume34
Issue number2
DOIs
StatePublished - Sep 2005

Keywords

  • Aging
  • Artificial neural network
  • Cu-Cr-Sn-Zn alloy
  • Levenberg-Marquard algorithm
  • Rapid solidification

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