Joining of 2D C/SiC composites with niobium alloy

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6 引用 (Scopus)

摘要

2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface. The highest shear stress of joint is 14.1 MPa.

源语言英语
页(从-至)1391-1396
页数6
期刊Wuji Cailiao Xuebao/Journal of Inorganic Materials
21
6
出版状态已出版 - 11月 2006

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