摘要
2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface. The highest shear stress of joint is 14.1 MPa.
源语言 | 英语 |
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页(从-至) | 1391-1396 |
页数 | 6 |
期刊 | Wuji Cailiao Xuebao/Journal of Inorganic Materials |
卷 | 21 |
期 | 6 |
出版状态 | 已出版 - 11月 2006 |