Abstract
2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface. The highest shear stress of joint is 14.1 MPa.
| Original language | English |
|---|---|
| Pages (from-to) | 1391-1396 |
| Number of pages | 6 |
| Journal | Wuji Cailiao Xuebao/Journal of Inorganic Materials |
| Volume | 21 |
| Issue number | 6 |
| State | Published - Nov 2006 |
Keywords
- C/SiC composites
- Joining
- Niobium alloy