TY - GEN
T1 - Constitutive behaviour of single lap joint of sintered silver paste
AU - Long, Xu
AU - Du, Chongyang
AU - Tang, Wenbin
AU - Liu, Yongchao
AU - Yao, Yao
AU - Jia, Fengrui
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12
Y1 - 2018/12
N2 - Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm × 2.0 mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from 10-3/s to 5×10-2/s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.
AB - Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm × 2.0 mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from 10-3/s to 5×10-2/s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.
UR - http://www.scopus.com/inward/record.url?scp=85091704163&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2018.8654407
DO - 10.1109/EPTC.2018.8654407
M3 - 会议稿件
AN - SCOPUS:85091704163
T3 - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
SP - 591
EP - 595
BT - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Y2 - 4 December 2018 through 7 December 2018
ER -