Constitutive behaviour of single lap joint of sintered silver paste

Xu Long; Chongyang Du; Wenbin Tang; Yongchao Liu; Yao Yao; Fengrui Jia

doi:10.1109/EPTC.2018.8654407

Constitutive behaviour of single lap joint of sintered silver paste

Xu Long, Chongyang Du, Wenbin Tang, Yongchao Liu, Yao Yao, Fengrui Jia

School of Mechanics,Civil Engineering and Architecture

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm × 2.0 mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from 10^-3/s to 5×10^-2/s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.

Original language	English
Title of host publication	2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	591-595
Number of pages	5
ISBN (Electronic)	9781538676684
DOIs	https://doi.org/10.1109/EPTC.2018.8654407
State	Published - Dec 2018
Event	20th IEEE Electronics Packaging Technology Conference, EPTC 2018 - Singapore, Singapore Duration: 4 Dec 2018 → 7 Dec 2018

Publication series

Name	2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018

Conference

Conference	20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Country/Territory	Singapore
City	Singapore
Period	4/12/18 → 7/12/18

Access to Document

10.1109/EPTC.2018.8654407

Cite this

Long, X., Du, C., Tang, W., Liu, Y., Yao, Y., & Jia, F. (2018). Constitutive behaviour of single lap joint of sintered silver paste. In 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018 (pp. 591-595). Article 8654407 (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2018.8654407

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title = "Constitutive behaviour of single lap joint of sintered silver paste",

abstract = "Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm × 2.0 mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from 10-3/s to 5×10-2/s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.",

author = "Xu Long and Chongyang Du and Wenbin Tang and Yongchao Liu and Yao Yao and Fengrui Jia",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 20th IEEE Electronics Packaging Technology Conference, EPTC 2018 ; Conference date: 04-12-2018 Through 07-12-2018",

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doi = "10.1109/EPTC.2018.8654407",

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Long, X, Du, C, Tang, W, Liu, Y, Yao, Y & Jia, F 2018, Constitutive behaviour of single lap joint of sintered silver paste. in 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018., 8654407, 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018, Institute of Electrical and Electronics Engineers Inc., pp. 591-595, 20th IEEE Electronics Packaging Technology Conference, EPTC 2018, Singapore, Singapore, 4/12/18. https://doi.org/10.1109/EPTC.2018.8654407

Constitutive behaviour of single lap joint of sintered silver paste. / Long, Xu; Du, Chongyang; Tang, Wenbin et al.
2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 591-595 8654407 (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Long, Xu

AU - Du, Chongyang

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AU - Jia, Fengrui

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N2 - Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm × 2.0 mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from 10-3/s to 5×10-2/s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.

AB - Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm × 2.0 mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from 10-3/s to 5×10-2/s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.

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Long X, Du C, Tang W, Liu Y, Yao Y, Jia F. Constitutive behaviour of single lap joint of sintered silver paste. In 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 591-595. 8654407. (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018). doi: 10.1109/EPTC.2018.8654407

Constitutive behaviour of single lap joint of sintered silver paste

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