A high sensitivity micromachined accelerometer with an enhanced inertial mass SOI MEMS process

Jianbing Xie, Meng Song, Weizheng Yuan

科研成果: 书/报告/会议事项章节会议稿件同行评审

14 引用 (Scopus)

摘要

This paper provides an enhanced inertial mass SOI MEMS process for the fabrication of a high sensitivity micromachined accelerometer. In the proposed process, the handle layer of the SOI wafer is used as an enhanced inertial mass, in this way, the inertial mass of the accelerometer can increase 5-15 times. Therefore, the sensitivity of the MEMS accelerometer can be significantly increased. In this paper, an in-plane single-axis accelerometer is designed firstly. And then, the accelerometer is fabricated in a low resistivity SOI wafer with 60μm thickness device layer and 400μm thickness handle layer through the developed enhanced inertial mass SOI MEMS process. The sensitivity of the fabricated MEMS accelerometer is 2.257V/g, the linearity of output is within 0.5%, and the power spectral density of the noises is as low as 6.79uV/√Hz.

源语言英语
主期刊名8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
336-339
页数4
DOI
出版状态已出版 - 2013
活动8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, 中国
期限: 7 4月 201310 4月 2013

出版系列

姓名8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

会议

会议8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
国家/地区中国
Suzhou
时期7/04/1310/04/13

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