聚酰亚胺基导热复合材料研究进展

Haitao Wang, Dongliang Ding, Qian Liu, Yanhui Chen, Qiuyu Zhang

科研成果: 期刊稿件文献综述同行评审

2 引用 (Scopus)

摘要

Polyimide (PI) has excellent high and low-temperature resistance, mechanical properties and corrosion resistance, but its poor intrinsic thermal conductivity limited its application in the electronic industry, aviation, aerospace and other fields. Introducing thermal conductive fillers into PI is an effective way to improve the thermal conductivity of PI composites. In this paper, the preparation methods of PI-based thermal conductive composites were summarized firstly; then the connected status of the thermal conductive fillers in PI matrix were mainly elucidated, that was, the dimension of space thermal conductive paths constructed by thermal conductive fillers in PI matrix, including one-dimensional, two-dimensional, quasi-three-dimensional and three-dimensional thermal conductive paths, and the performance of thermal conductivity of PI-based composites with different thermal conductive paths was accordingly described. Furthermore, the basic thermal conductivity model for PI-based composites was briefly introduced. Finally, the future research direction of PI-based thermal conductivity composites was put forward.

投稿的翻译标题Advances in Polyimide Based Thermal Conductive Composites
源语言繁体中文
页(从-至)159-166
页数8
期刊Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
35
8
DOI
出版状态已出版 - 1 8月 2019

关键词

  • Composite
  • Polyimide
  • Thermal conductivity

指纹

探究 '聚酰亚胺基导热复合材料研究进展' 的科研主题。它们共同构成独一无二的指纹。

引用此