TY - JOUR
T1 - 聚酰亚胺基导热复合材料研究进展
AU - Wang, Haitao
AU - Ding, Dongliang
AU - Liu, Qian
AU - Chen, Yanhui
AU - Zhang, Qiuyu
N1 - Publisher Copyright:
© 2019, Editorial Board of Polymer Materials Science & Engineering. All right reserved.
PY - 2019/8/1
Y1 - 2019/8/1
N2 - Polyimide (PI) has excellent high and low-temperature resistance, mechanical properties and corrosion resistance, but its poor intrinsic thermal conductivity limited its application in the electronic industry, aviation, aerospace and other fields. Introducing thermal conductive fillers into PI is an effective way to improve the thermal conductivity of PI composites. In this paper, the preparation methods of PI-based thermal conductive composites were summarized firstly; then the connected status of the thermal conductive fillers in PI matrix were mainly elucidated, that was, the dimension of space thermal conductive paths constructed by thermal conductive fillers in PI matrix, including one-dimensional, two-dimensional, quasi-three-dimensional and three-dimensional thermal conductive paths, and the performance of thermal conductivity of PI-based composites with different thermal conductive paths was accordingly described. Furthermore, the basic thermal conductivity model for PI-based composites was briefly introduced. Finally, the future research direction of PI-based thermal conductivity composites was put forward.
AB - Polyimide (PI) has excellent high and low-temperature resistance, mechanical properties and corrosion resistance, but its poor intrinsic thermal conductivity limited its application in the electronic industry, aviation, aerospace and other fields. Introducing thermal conductive fillers into PI is an effective way to improve the thermal conductivity of PI composites. In this paper, the preparation methods of PI-based thermal conductive composites were summarized firstly; then the connected status of the thermal conductive fillers in PI matrix were mainly elucidated, that was, the dimension of space thermal conductive paths constructed by thermal conductive fillers in PI matrix, including one-dimensional, two-dimensional, quasi-three-dimensional and three-dimensional thermal conductive paths, and the performance of thermal conductivity of PI-based composites with different thermal conductive paths was accordingly described. Furthermore, the basic thermal conductivity model for PI-based composites was briefly introduced. Finally, the future research direction of PI-based thermal conductivity composites was put forward.
KW - Composite
KW - Polyimide
KW - Thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=85073879198&partnerID=8YFLogxK
U2 - 10.16865/j.cnki.1000-7555.2019.0217
DO - 10.16865/j.cnki.1000-7555.2019.0217
M3 - 文献综述
AN - SCOPUS:85073879198
SN - 1000-7555
VL - 35
SP - 159
EP - 166
JO - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
JF - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
IS - 8
ER -