High temperature thin film thermocouples on different ceramic substrates

Xinhang Jin, Binghe Ma, Jinjun Deng, Chengyu Ma

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

This paper was directed at the effect of ceramic substrate on NiCr/NiSi film thermocouples fabricated on two ceramics substrate. One was on smooth Al2O3 substrate. The other was on silicon carbide ceramic reinforced by carbon fiber (CFCC-SiC). Since the CFCC-SiC has rough surface, the stress between the layer was greater and the thin film was easier to crack. With experiments the measure temperature of the thin film thermocouples on both of them could reach 700°C. Calibrate test data showed that the high-temperature stability of the thin film thermocouple on smooth Al2O3 substrate was much better than the other.

Original languageEnglish
Title of host publication2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages183-186
Number of pages4
ISBN (Electronic)9781467366953
DOIs
StatePublished - 1 Jul 2015
Event10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015 - Xi'an, China
Duration: 7 Apr 201511 Apr 2015

Publication series

Name2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015

Conference

Conference10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
Country/TerritoryChina
CityXi'an
Period7/04/1511/04/15

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