TY - GEN
T1 - Utilizing a Robot to Endow Virtual Objects with Stiffness
AU - Dong, Jiepeng
AU - He, Weiping
AU - Zheng, Bokai
AU - Liu, Yizhe
AU - Billinghurst, Mark
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper proposes a novel approach to provide stiffness feedback in VR utilizing the inherent characteristics of encounter-type haptic devices (ETHDs). The method aims to provide a sense of object's deformation and enhance users' perception of stiffness when touching objects. We explored how to minimize the influence of hardness on stiffness perception and selected materials for the soft, medium, and hard hardness mapping groups to adapt to users' perceptions when touching objects of different hardness levels. Using this system, we compared and evaluated the method with a touch interaction without stiffness perceptions and found a better performance in terms of realism, possibility to act, attractiveness, efficiency.
AB - This paper proposes a novel approach to provide stiffness feedback in VR utilizing the inherent characteristics of encounter-type haptic devices (ETHDs). The method aims to provide a sense of object's deformation and enhance users' perception of stiffness when touching objects. We explored how to minimize the influence of hardness on stiffness perception and selected materials for the soft, medium, and hard hardness mapping groups to adapt to users' perceptions when touching objects of different hardness levels. Using this system, we compared and evaluated the method with a touch interaction without stiffness perceptions and found a better performance in terms of realism, possibility to act, attractiveness, efficiency.
KW - Haptic
KW - Human computer interaction
KW - Human-centered computing
KW - Human-centered computing
KW - Interaction devices
KW - Interaction paradigms
KW - User studies
KW - Virtual reality Human-centered computing
UR - http://www.scopus.com/inward/record.url?scp=85180371797&partnerID=8YFLogxK
U2 - 10.1109/ISMAR-Adjunct60411.2023.00108
DO - 10.1109/ISMAR-Adjunct60411.2023.00108
M3 - 会议稿件
AN - SCOPUS:85180371797
T3 - Proceedings - 2023 IEEE International Symposium on Mixed and Augmented Reality Adjunct, ISMAR-Adjunct 2023
SP - 496
EP - 500
BT - Proceedings - 2023 IEEE International Symposium on Mixed and Augmented Reality Adjunct, ISMAR-Adjunct 2023
A2 - Bruder, Gerd
A2 - Olivier, Anne-Helene
A2 - Cunningham, Andrew
A2 - Peng, Evan Yifan
A2 - Grubert, Jens
A2 - Williams, Ian
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE International Symposium on Mixed and Augmented Reality Adjunct, ISMAR-Adjunct 2023
Y2 - 16 October 2023 through 20 October 2023
ER -