Three influential factors on colloidal nanoparticle deposition for heat conduction enhancement in 3D chip stacks

Feifei Qin, Jianlin Zhao, Qinjun Kang, Thomas Brunschwiler, Jan Carmeliet, Dominique Derome

科研成果: 期刊稿件 › 文章 › 同行评审

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Chemical Engineering

Engineering