Thermal conductivities of plain woven C/SiC composite: Micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids

Yingjie Xu, Shixuan Ren, Weihong Zhang

科研成果: 期刊稿件 › 文章 › 同行评审

60 引用 （Scopus）

指纹

探究 'Thermal conductivities of plain woven C/SiC composite: Micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids' 的科研主题。它们共同构成独一无二的指纹。

Engineering

Material Science