Solidification pathways of ternary Cu62.5Fe27.5Sn10 alloy modulated through liquid undercooling and containerless processing

Z. C. Xia, W. L. Wang, Y. H. Wu, S. B. Luo, B. Wei

科研成果: 期刊稿件 › 文章 › 同行评审

6 引用 （Scopus）

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Engineering

Material Science